Wafer protective coating solution for laser sawing(dicing, grooving, cutting)
Application : Si wafer,Poly-Si wafer, GaN-Si wafer, etc
Not removed melt Si particles during wafer Laser Sawing(Dicing, Grooving) can cause the unexpected problems.
These particles are hard to remove with DI water cleaning.
To prevent this problems and to protect the chip surface, WCS-2G is needed to coat the surface of wafers before laser sawing(dicing, grooving, cutting)
WCS-2G have excellent leveling, Good slippage after drying, Perfect cleaning with DI water.
* Physical properties
Translucent Viscous Liquid
pH (at 20℃)
Specific gravity (at 20℃)
Viscosity (cps at 20℃)
주)1: Brookfiled Viscometer (DV-Ⅱ+Pro, Spindle No. 2, 20rpm), Able to customize this value.
If you have any questions on this product, please contact to our sales team TANGO by e-mail or by phone.
e-Mail : email@example.com, Tel : +82-31-459-3377