WCS-2G

TOPCover(TM) WCS-2G

 

 

Wafer protective coating solution for laser sawing(dicing, grooving, cutting)

Application : Si wafer,Poly-Si wafer, GaN-Si wafer, etc

 

 

 

Not removed melt Si particles during wafer Laser Sawing(Dicing, Grooving) can cause the unexpected problems.

These particles are hard to remove with DI water cleaning.

 

To prevent this problems and to protect the chip surface, WCS-2G is needed to coat the surface of wafers before laser sawing(dicing, grooving, cutting)

 

WCS-2G have excellent leveling, Good slippage after drying, Perfect cleaning with DI water. 

 

 

* Physical properties

Items

Result

Test method

Base polymer

Polyvinyl Alcohol(PVA)

Appearance

Translucent Viscous Liquid

Visual test

pH (at 20)

3~4

pH meter

Orion 520A

Specific gravity (at 20)

1.02~1.03

Hydrometer

Fisher Scientific

Viscosity (cps at 20)

55~65

Remark)1

)1: Brookfiled Viscometer (DV-+Pro, Spindle No. 2, 20rpm), Able to customize this value.



If you have any questions on this product, please contact to our sales team TANGO by e-mail or by phone.

e-Mail : sales@inyourside.com, Tel : +82-31-459-3377

제품구입방법

TEL 031.459.3377
FAX 031.8068.1188

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